| Titre : | Design of Dip Coater |
| Auteurs : | Hadil Makhloufi, Auteur ; Noureddine Sengouga, Directeur de thèse |
| Type de document : | Monographie imprimée |
| Editeur : | Biskra [Algérie] : Faculté des Sciences Exactes et des Sciences de la Nature et de la Vie, Université Mohamed Khider, 2024 |
| Format : | 1VOL.(60p) / ill.couv.ill.en coul / 30cm |
| Langues: | Anglais |
| Langues originales: | Anglais |
| Résumé : |
This thesis focuses on the design, development, and automation of a low-cost dip coater for thinfilm deposition. Thin films play a crucial role in modern industries such as electronics, optics, and renewable energy due to their unique properties and versatile applications. However, the high cost of commercial dip coaters limits their accessibility for smaller laboratories and startups. This work presents a solution through the development of an automated, cost-effective dip coating system. The system integrates mechanical components, stepper motors, and an intuitive user interface using a TFT SPI LCD for real-time monitoring. Additionally, safety features such as emergency stops and overload protection are incorporated to ensure secure operation. The dip coater's design allows for customizable parameters, offering flexibility for various thin-film deposition applications. |
| Sommaire : |
I.1 Introduction: ............................................................................................................................... 1 I.2 Definition of thin films: ............................................................................................................. 1 I.2.1 The mechanisms of thin film growth: ..................................................................................... 2 I.2.2 Nucleation: .............................................................................................................................. 2 I.2.3 Coalescence: ........................................................................................................................... 2 I.2.4 Growth: ................................................................................................................................... 3 I.3 Properties of thin films: ............................................................................................................. 4 I.3.1 Mechanical properties: ............................................................................................................ 4 I.3.2 Electrical properties: ............................................................................................................... 6 I.3.3 Optical properties: ................................................................................................................... 7 I.4 Applications of Thin Films: ....................................................................................................... 8 I.4.1 Electric and optoelectronic applications: ................................................................................ 8 I.4.2 Thin films as optical coatings: .............................................................................................. 10 I.4.3 Corrosion and oxidation protection: ..................................................................................... 10 I.4.4 Biomedical applications: ....................................................................................................... 11 References of Chapter Ⅰ: ................................................................................................................ 12 Chapter Ⅱ: Methods of thin films deposition Ⅱ.1 Introduction............................................................................................................................. 16 Ⅱ.2 Thin Films Deposition Process: .............................................................................................. 16 Ⅱ.3 Physical Vapor Method (PVD):.............................................................................................. 17 II.3.1 Thermal evaporation by resistive heating: ........................................................................... 18 II.3.2 Electron beam evaporation: ................................................................................................. 18 II.3.3. Sputtering: .......................................................................................................................... 19 II.3.4 Pulsed laser deposition (PLD): ............................................................................................ 20 II.3.5 Molecular Beam Epitaxy (MBE): ........................................................................................ 21 II.4.1 Spray Pyrolysis technique: .................................................................................................. 24 II.4.2. Sol-gel technique: ............................................................................................................... 25 II.4.2.1. Spin coating process: ....................................................................................................... 26 References of Chapter Ⅱ: .............................................................................................................. 28 Chapter Ⅲ: The Dip Coater Models Ⅲ.1 Intoduction: ........................................................................................................................... 31 Ⅲ.2 Overview of Dip Coating: ..................................................................................................... 31 Ⅲ.3 Dip Coating Theory: .............................................................................................................. 32 Ⅲ.3.1 Withdrawal and Film Formation: ....................................................................................... 32 Ⅲ.3.2 Viscous Flow and Drainage Regime: ................................................................................. 34 Ⅲ.3.3 Drying Dynamics: .............................................................................................................. 34 Ⅲ.3.4 Capillary Regime: ............................................................................................................... 36 Ⅲ.4 Types of Dip Coater: ............................................................................................................. 36 Ⅲ.4.1 Manual Dip Coaters: .......................................................................................................... 36 Ⅲ.4.2 Automated Dip Coaters: ..................................................................................................... 36 Ⅲ.4.3 Bench-Top Dip Coaters: ..................................................................................................... 37 Ⅲ.4.4 Industrial Dip Coaters: ....................................................................................................... 37 Ⅲ.5 Classification of Dip Coater Models: .................................................................................... 38 Ⅲ.5.1 Based on Functionality: ...................................................................................................... 38 Ⅲ.5.2 Based on Size: .................................................................................................................... 39 Ⅲ.5.3 Based on Applications: ....................................................................................................... 41 Ⅲ.6 Comparison of Popular Models: ............................................................................................ 42 Ⅲ.6.1 Case Studies and Practical Use: ......................................................................................... 43 Ⅲ.7 Future Trends in Dip Coating Technology: .......................................................................... 44 Ⅲ.7.1 Advancements in Automation: ........................................................................................... 44 Ⅲ.7.2 Nanomaterial Integration: ................................................................................................... 44 Ⅲ.7.3 Green and Sustainable Coating Solutions: ......................................................................... 44 Referenses of Chapter Ⅲ: ............................................................................................................. 45 Ⅳ.1 Introduction: .......................................................................................................................... 49 Ⅳ.2 Design and Construction: ...................................................................................................... 49 Ⅳ.2. Structural Design: ................................................................................................................ 49 Ⅳ.2.2 Mechanical Components: ................................................................................................... 49 Ⅳ.2.2.1 Dipping Arm: .................................................................................................................. 49 Ⅳ.2.2.2 Drive System: .................................................................................................................. 51 Ⅳ.3 Electronics and Controls: ...................................................................................................... 52 Ⅳ.3.1 Controller: .......................................................................................................................... 52 Ⅳ.3.2 Sensors: .............................................................................................................................. 53 Ⅳ.3.3 Power Supply: .................................................................................................................... 53 Ⅳ.3.4 Type of Microcontroller: .................................................................................................... 54 Ⅳ.3.5 Connectivity Options: ........................................................................................................ 54 Ⅳ.3.6 Schematic circuit: ............................................................................................................... 54 Ⅳ.4 Control System and Softwar: ................................................................................................ 55 Ⅳ.4.1 Automation Framework: .................................................................................................... 55 Ⅳ.4.2 User Interface: .................................................................................................................... 56 Ⅳ.4.3 Safety Features: .................................................................................................................. 56 Ⅳ.4.4 User Interface with TFT SPI LCD: .................................................................................... 57 Ⅳ.4.5 Assembly and Construction Process: ................................................................................. 58 References of Chapter Ⅳ: ............................................................................................................. 59 General Conclusion ....................................................................................................................... 60 |
| Type de document : | Mémoire master |
Disponibilité (1)
| Cote | Support | Localisation | Statut |
|---|---|---|---|
| MPHY/655 | CDROM | bibliothèque sciences exactes | Consultable |
